3D-MPSoC offer great performance and scalability benefits. However, due to strong vertical thermal correlation and increased power density, thermal challenges in 3D-MPSoC are critical. In this paper, we propose a novel thermal aware task scheduling technique that combine intelligent task mapping with DVFS to minimize the peak temperature of the system. Particularly, our approach leverages on the fundamental thermal characteristics of 3D architecture when mapping tasks to processing cores and employing DVFS at design time followed by a simple thermal optimization step at run time. Our experiments validate the efficiency of our approach in peak temperature minimization up to 14°C compared to other existing methods. © 2014 IEEE.