Indian Institute of Technology Palakkad&nbsp;(IIT Palakkad or IIT PKD) is a public autonomous&nbsp;engineering&nbsp;and&nbsp;research&nbsp;institute located in&nbsp;Palakkad,&nbsp;Kerala. It was&nbsp;one of the five new&nbsp;IITs&nbsp;proposed in the&nbsp;2014 Union budget of India. The campus was inaugurated on 3 August 2015. The institute has 94 faculty, 978 students, and 63 non-teaching staffs.

IT Palakkad currently offers four-year Bachelor of Technology (B.Tech) and two years MS programmes in 8 different engineering disciplines including&nbsp;Computer Science, Electrical, Mechanical, Civil among others.

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IIT Palakkad

Increasing demand for precision miniaturised components made of hard and brittle materials can no longer meet the requirements by conventional machining and advanced machining processes. To facilitate high precision machining, vibration is introduced in any of workpiece, tool and working medium, which is called Vibration Assisted Machining (VAM). In this review, the advancements of VAM in conventional machining as well as in advanced machining are presented. In detail, general overview, classifications, basic kinematics of 1-D and 2-D VAM, chip formation and instrumental implementation issues of VAM, are discussed. In addition to this the reasons for improvements in machining process and promising areas to be explored in VAM are summarized. © 2014 The Authors.

World University root node

Department of Mechanical Engineering

Procedia Engineering

Vibration assisted conventional and advanced machining: A review

Micro electric discharge milling (μ-ED milling) is an effective and economic process for the fabrication of micro channels. In the present work, the bulk approach of μ-ED milling is being attempted to make complex shaped micro channels. For a straight channel the bulk approach of μ-ED milling was found to be a successful approach. A tungsten tool of diameter 500 μm was used to fabricate semi-circular micro channels on EN-24 steel. Important machining parameters had earlier been optimized to make straight channels on EN-24 steel by the same method. The effect of geometrical parameters such as radius of curved channel and aspect ratio on MRR and TWR were studied by full factorial experimental design for single pass at optimized machining parameters. Finally complex shapes like T-type and serpentine channels were made by using optimized conditions of straight and curved channels by bulk approach with multiple passes of μ-ED milling. Copyright © 2013 by ASME.

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Fabrication of complex micro channels by micro electric discharge milling (μ-ED milling)

Micro electric discharge machining (μ-EDM) process is being used to machine complex shapes on silicon. In specific, dry-μ-EDM can be used to process assembled or semi assembled silicon products. However, there is lack of investigation on the effect of single pulse discharge machining and its plasma characteristics on silicon. Hence, in this paper we investigate the crater and plasma characteristics of single discharge for various conditions such as different electrode diameters and different energy conditions (fixed voltage with varying capacitance and vice-versa). The plasma temperature and electron density have been calculated by line pair method and modified Saha equation respectively. The values are mapped into the plasma classification plot based on log scale of plasma temperature and electron density and realised that at μ-scale EDM plasma was found to be ideal up to 50 mJ energy and tends to become weakly non-ideal plasma for 98 mJ energy. Also from the influence of energy on plasma characteristics it is understood that electron density also plays a major role along with the plasma temperature. © 2012 Inderscience Enterprises Ltd.

International Journal of Mechatronics and Manufacturing Systems

Investigation of single pulse discharge on silicon: Crater and plasma characteristics

Microelectric discharge plasma characteristic using optical emission spectroscopy and its applications are reported. Planar semiconductor as well as metal electrodes as anode and metal cylindrical electrode as a cathode are utilized. Plasma parameters such as plasma temperature and electron density were measured by noncontact optical emission spectroscopy. Plasma temperature has been calculated by line pair method and electron density calculated by modified Saha equation. A comparison between the plasma temperature and electron density of discharge plasma for different electrode combinations have been investigated. Systematic variations with respect to the plasma properties have been noticed for varying energy conditions. Application of electric discharge in surface processing and elemental identification of materials have also been demonstrated. © 2012 Copyright Taylor and Francis Group, LLC.

Materials and Manufacturing Processes

Microelectric discharge plasma: Characterization and applications

An attempt was made to characterize the dry microelectric discharge machining (μ-EDM) plasma systematically by using optical emission spectroscopy. In order to characterize the plasma and its parameters such as plasma temperature, electron density, Debye length, and gamma parameter, the optical spectra were recorded for different energies and with different diameters of tool electrode. From the recorded spectra, using line pair method and modified Saha equation, plasma temperature and electron density, respectively were calculated. From these two, Debye length and plasma parameter were also calculated. These studies indicate that the plasma produced in dry μ-EDM is ideal. In addition to this, we found that the dry μ-EDM region is below the conventional EDM region in log electron density and log temperature plot. Morphological analysis was carried out on crater produced by different energies on the workpiece using a scanning electron microscope. The crater shape may dependent on the geometry of the tool tip, number of discharges, and energy of discharge. © 2011 Springer-Verlag London Limited.

International Journal of Advanced Manufacturing Technology

Plasma characterization of dry μ-EDM

Elemental identification of material is a prime most important in material science field. Electric discharge is used for material elemental identification with optical emission spectroscopy. During electric discharge machining between two electrodes plasma is generated which emits intense radiation in the UV-Visible region. The generated plasma captured by optical emission spectroscopic technique and elements are identified from recorded spectra by matching with standard NIST database. This method is simple, rapid, and inexpensive compared to all other elemental identification method. The elements of the metal, semiconductors, even insulators can be identified without much difficulty. The elemental identification of material has been investigated in macro and micro level. © (2011) Trans Tech Publications, Switzerland.

Advanced Materials Research

Elemental identification of materials using optical emission spectra during electric discharge machining

To improve the performance of the Electric discharge machining (EDM) process it is of interest to characterize the plasma involved. Plasma temperature needs to be measured as an initial phase of plasma characterization. Non-contact optical emission spectroscopy has been used to measure the plasma temperature. The plasma temperature and crater morphology has been investigated for different energy conditions on Silicon in dry μ-EDM condition. The plasma temperature is calculated using line pair method and crater morphology analyzed by scanning electron microscope (SEM) and profilometer. © (2011) Trans Tech Publications, Switzerland.