Publications - 47Publications - 47
Publications - 47Publications (47)
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ConferencesOptimization of friction stir processing parameters for the development of cu-w surface composite2019 | Trans Tech Publications Ltd- ArticlesModeling flow behavior of sintered Al-4%B4C composite during high-temperature upsetting2019 | Institute of Physics Publishing
ArticlesLaser dimple texturing–applications, process, challenges, and recent developments: a review2019 | Taylor and Francis Ltd.
ArticlesElectric discharge texturing of HSS cutting tool and its performance in dry machining of aerospace alloy2019 | Springer Verlag
ArticlesInvestigation of magnetic field and shielding gas in electro-discharge deposition process2019 | SAGE Publications Ltd- ArticlesPost-processing of Laser Additive Manufactured Inconel 718 Using Laser Shock Peening2019 | SpringerOpen
ConferencesFunctionally graded materials and processing techniques: An art of review2018 | Elsevier Ltd- ArticlesAnalysis of Grain Size Evolution of Sintered Al–4wt.%B4C Preforms Subjected to Hot Compression2018 | Springer New York LLC
- ArticlesMicrostructure Modeling of Dynamically Recrystallized Grain Size of Sintered Al-4 wt % B4C Composite during Hot Upsetting2018 | American Society of Mechanical Engineers (ASME)
- ArticlesPerformance of laser surface textured high speed steel cutting tool in machining of Al7075-T6 aerospace alloy2017 | Elsevier B.V.
- ConferencesInfluence of Temperature on the Workability and Hardness of Sintered Al-4%B4C in Upsetting Test2017 | Elsevier Ltd
- ArticlesHot workability and densification behavior of sintered powder metallurgy Al-B4C preforms during upsetting2017 | Elsevier Ltd
- ArticlesParametric investigations to enhance the thermomechanical properties of CuAlNi shape memory alloy Bi-morph2017 | ELSEVIER SCIENCE SA
ConferencesOptimization of drilling parameters of fabricated GFRP composite using Taguchi method2016 | Institute of Electrical and Electronics Engineers Inc.- ConferencesOptimization of parameters for uniform magnetic field2015 | Institute of Electrical and Electronics Engineers Inc.
